ABERDEEN PROVING GROUND, Md. — The Army Materiel Command and Army Futures Command held a ceremony today transitioning the U.S. Army Research, Development and Engineering Command from AMC to AFC. The official date of the transfer is Feb. 3 during which RDECOM will be renamed Combat Capabilities Development Command.
“The United States Army has been focused on the near-term for the last 18 years and rightfully so. But as we wind down and come out of the conflicts in Iraq and Afghanistan the message is very, very clear, we need to re-focus on large-scale, ground combat and we need to refocus on the future,” said Gen. John M. Murray, commanding general AFC.
As the Army’s newest command and the largest of AFC’s three major elements, CCDC comprises eight major and three international centers and laboratories including: Data & Analysis Center; Armaments Center; Army Research Laboratory; Aviation and Missile Center; Chemical Biological Center; Command, Control, Computers, Communications, Cyber, Intelligence, Surveillance and Reconnaissance Center; Ground Vehicle Systems Center; and Soldier Center. The international elements are the regionally aligned Americas, Atlantic and Pacific Centers. … Read More
ABERDEEN PROVING GROUND, Md. — Engineers at the US Army Research, Development and Engineering Command’s Communications-Electronics Center recently headed into the classroom to explore the possibilities of using advanced 3D printing processes as a means to support Army readiness and modernization.
“The center’s Product Realization Systems Engineering and Quality Directorate, or PRD, hosted Additive Manufacturing 101, the first training course of its kind here. Twenty engineers, logisticians and quality personnel from across the Communications-Electronics Center and Communications-Electronics Command, or CECOM, attended the three-day course for hands-on experience.
Additive manufacturing, or AM, has been around for three decades, but in the course of the last few years, AM’s 3D printing processes have markedly and rapidly improved through high-performance computing which allows better modeling along with the addition of new materials that make manufactured parts more robust; as a result, its applications have become more extensive and applicable to the Army’s mission.. … Read More